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CHEM-ENG590E Wiki Textbook:Microcontact Printing: Difference between revisions
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CHEM-ENG590E Wiki Textbook:Microcontact Printing (view source)
Revision as of 09:08, 15 April 2016
, 15 April 2016→Challenges of Microcontact Printing
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Similar to roof collapse, pairing can occur due to a high stamp aspect ratio, specifically narrow feature roofs. Adhesive forces between the interface of adjacent features can cause them to pair up and deform the stamp pattern. Delamarche et al. studied the stability of PDMS microstructures<sup>[12]</sup>, and they proposed that during drying of the stamp for wet inking, the receding solvent meniscus induced local capillary forces driving the microstructures together. | Similar to roof collapse, pairing can occur due to a high stamp aspect ratio, specifically narrow feature roofs. Adhesive forces between the interface of adjacent features can cause them to pair up and deform the stamp pattern. Delamarche et al. studied the stability of PDMS microstructures<sup>[12]</sup>, and they proposed that during drying of the stamp for wet inking, the receding solvent meniscus induced local capillary forces driving the microstructures together. | ||
*'''Stamp volume defects (shrinking or swelling)''' | *'''Stamp volume defects (shrinking or swelling)''' | ||
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*'''Ink mobility''' | *'''Ink mobility''' | ||
Vapor phase diffusion and surface diffusion of the ink can occur during contact with the substrate, and may lead to ink spreading into undesirable regions of both the stamp and the substrate. Resulting patterns typically have low or poor resolution and may look splotchy or warped if the ink diffusion is high. | |||
==Cutting Edge Techniques== | ==Cutting Edge Techniques== | ||
