Godin:Protocols/Multilayer PDMS: Difference between revisions
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*'''30 min degass''' | *'''30 min degass''' | ||
Place | Place the dish in the vacuum chamber, and allow it to degass for 30 minutes, or until it stops bubbling. To prevent overflow, you may have to periodically break vacuum and allow some bubbles to escape. | ||
*'''12 min @ 80°C''' | *'''12 min @ 80°C''' | ||
The dish is now placed in the oven for 12 min at 80°C. The idea is to partially cure the PDMS, so it's solid but still sticky. Let the PDMS cool for about an hour afterwards; this will facilitate the next step. | |||
*'''Punch valve holes''' | *'''Punch valve holes''' | ||
Use the 0.75 mm hole punch to | |||
*'''Cleaning''' | *'''Cleaning''' | ||
Revision as of 11:22, 17 May 2011
Safety
Materials
DescriptionThis protocol details the fabrication of a 2 layer PDMS device, consisting of a valve layer (top) and channel layer (below). It is assumed that masters for respective layers have already been fabricated (see Godin:Protocols/SU-8 Master, Godin:Protocols/AZ Master). The idea is to modify the silicone elastomer base to curing agent ratio, thereby modifying PDMS elasticity. Valve Layer
For most devices, 80g of PDMS is sufficient to produce reasonably-sized devices. Weigh 70g of silicone elastomer base on the scale using the weighing dish, then add 10g of curing agent. Make sure to maintain the 7:1 ratio; if too much is added, add more base as required. Use a pipette tip to mix the solution for 10 min under the fume hood. Blow dry the valve master with nitrogen, and place in a polystyrene dish. Use Scotch tape to fix the wafer at the center of the dish by taping all sides. We want to prevent the wafer from floating up, or PDMS from getting under the wafer. Close the dish with the lid.
Place the dish in the vacuum chamber, and allow it to degass for 30 minutes, or until it stops bubbling. To prevent overflow, you may have to periodically break vacuum and allow some bubbles to escape.
The dish is now placed in the oven for 12 min at 80°C. The idea is to partially cure the PDMS, so it's solid but still sticky. Let the PDMS cool for about an hour afterwards; this will facilitate the next step.
Use the 0.75 mm hole punch to
Fluidic Layer
Device Fabrication
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