Koch Lab:Protocols/Photolithography

Legend: "->" denotes physically pushing the button on the machine with the text that appears directly after symbol.

Preheat hotplate for prebaking wafer

• ->set
• ->plate temp
• ->"desired temp"
• ->ent

Applying photo resist

1. Place wafer on spin coating machine
   • ->speed (input speed)
   • ->accel (input acceleration)
   • ->time (input time)
   • ->save->back
   • ->run process
   • ->load recipe
   • ->"file name"
2. Manually center wafer by "eyeballing" it (this may take several tries)
3. Turn on vacuum pump (manually)
   • ->center
4. Manually adjust wafer if needed (repeat previous 2 steps)
5. poor photo resist
   • ->spin
   • ->ok
6. Move wafer to hot plate
   • wait 15 minutes
7. Hook up vacuum hose to UV exposer
8. Turn on Nitrogen
9. UV exposer
   • Pull white lever
   • ->start
   • wait for 200W
   • ->Power
   • ->visual align
   • Tape mask onto glass (place glass side up)
     • ->mask clamp
   • Load wafer on tray below
     • ->chuck vac
   • Push slide in
     • ->mask load
     • ->visual align
     • ->wafer load
     • ->cont (pushes wafer against mask)
   • Set time
     • ->manual espose
   • ->chuck vac
   • remove wafer